금속 박막 표면 인가 하중에 따른 나노 마이크로 스케일 가공 특성 연구

Abstract

The lithography process is typically employed in crafting nanoscale patterns; however, this method suffers fromlimitations such as restricted material compatibility and design flexibility. To overcome these challenges, mechanicalmachining is utilized to capitalize on the cutting tool geometries to provide an enhanced design freedom and abroader range of material choices. In this study, a meticulous thin film surface cutting process was executed at thenano- and micro-scale. This was achieved by precisely controlling the load applied to the Cu and Ni metal films,which are commonly used in semiconductor interconnections and catalysts. Subsequently, the dimensions of themachined nano- and micro-surface pattern were rigorously scrutinized. Notably, an increase in the vertical loadapplied to the cutting tool correlated with a proportional increase in the depth and width of the surface patterns. Furthermore, nano-indentation analysis was used to obtain insights into the hardness and elastic modulus of Cu andNi, thereby facilitating a quantitative comparison of the processing characteristics of different metal materials.