초음파 분무공정에 의한 표면실장용 Solder Ball 제조에 관한 연구
- Alternative Title
- A Study on th Fabrication of Solder Ball for Electronic Package by Pulse Atomization Process
- Abstract
- 전자기기의 소형, 경량화와 고기능, 고성능화의 요구에 의해 배선기판에 고밀도로 실장하는 실장기술(surface mounting technology, SMT)이 요구되고 있다. 이러한 고밀도화에 발맞춰 등장한 것이 BGA( Ball Grid Array)기술이다. 이 BGA package 기술에 사용되는 Solder Ball 들은 많은 방법(melting cut solder wires, centrifugal atomization, …)으로 제조되고 있다. 본 연구에서는 ultrasonic atomization 방법을 이용하여 액적 형성에 있어서의 인자들을 변화시킬 때 액적 거동에 미치는 영향을 분석하고 균일한 액적 제조의 최적조건을 규명하고자 하였다. 연구 결과, 낮은 비용으로 높은 표면조도, 높은 진구도 목표직경의 ±3% 이내의 좁은 입도분포, 균일한 미세조직, 및 균일한 remelting 특성을 갖는 Sn-37%Pb 합금의 Solder Ball을 얻을 수 있었다.
As the microelectronics industry rapidly progresses toward miniaturized, high-performance devices, chip packages with higher input/output(I/O) connections are required. One solution to this ever-demanding requirement is the BGA package, a type of surface mount chip package. In this study, we have found that mono-sized balls of the eutectic Sn-37%Pb alloy was produced by controlling the break-up of a continuous laminar jet into uniform droplets and by rapidly solidifying the droplets in a silicon oil bath. We successfully fabricated solder balls, which have high sphericity, narrow size distribution(within ±3% of the targer diameter), uniform. rapidly solidified microstructures, and uniform re-melting characteristics due to their homogeneous microstructures using PAP(pulsated atomization process).
As the microelectronics industry rapidly progresses toward miniaturized, high-performance devices, chip packages with higher input/output(I/O) connections are required. One solution to this ever-demanding requirement is the BGA package, a type of surface mount chip package. In this study, we have found that mono-sized balls of the eutectic Sn-37%Pb alloy was produced by controlling the break-up of a continuous laminar jet into uniform droplets and by rapidly solidifying the droplets in a silicon oil bath. We successfully fabricated solder balls, which have high sphericity, narrow size distribution(within ±3% of the targer diameter), uniform. rapidly solidified microstructures, and uniform re-melting characteristics due to their homogeneous microstructures using PAP(pulsated atomization process).
- Author(s)
- 김경원; 정은
- Issued Date
- 1999
- Type
- Research Laboratory
- URI
- https://oak.ulsan.ac.kr/handle/2021.oak/3980
http://ulsan.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000002024874
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