WC-Cu 電氣接點材의 燒結에 미치는 微量 코발트添加의 영향

Abstract

WC-Cu 전기접점재의 소결성과 접점 성질을 向上시키기 위해, 活性燒結法에 의해 微量의 Co를 첨가한 WC-Cu系의 소결거동을 조사하였다.

微量의 Co첨가에 의해 WC-Cu系의 소결에 현저한 영향을 미치며, Co는 液相의 양이 많을 때 액상소결을 촉진시키고, Cu의 量이 30v/0이상에서는 순수한 WC-Cu系에 비해 큰 수축율을 보여 주었다.

Co를 첨가한 WC-Cu접점재는 통상의 WC-Cu系에 비해 우수한 기계적 성질 및 접점 특성을 보여 주었다.

By the activated sintering method, the sintering behavior of the Co-doped WC-Cu electrical contact materials was investigated with hoping that the improved contact property and sinterability sould be obtained.

The addition of cobat to WC-Cu alloy had a markable effect on the sinterability. Cobalt accelerates the sintering process in the presence of enough piquid phase. The Co-added WC-Cu compacts had shown large shrinkage than the pure WC-Cu compact, if copper content was over 30v/0.

After infilteration the Co added WC-Cu dlectrical contact material has shown also better mechanical and electrical propertics than the conventional WC-Cu alloy.

By the activated sintering method, the sintering behavior of the Co-doped WC-Cu electrical contact materials was investigated with hoping that the improved contact property and sinterability sould be obtained.

The addition of cobat to WC-Cu alloy had a markable effect on the sinterability. Cobalt accelerates the sintering process in the presence of enough piquid phase. The Co-added WC-Cu compacts had shown large shrinkage than the pure WC-Cu compact, if copper content was over 30v/0.

After infilteration the Co added WC-Cu dlectrical contact material has shown also better mechanical and electrical propertics than the conventional WC-Cu alloy.